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SPP1413

Description
Trench FET
CategoryDiscrete semiconductor   
File Size203KB,8 Pages
ManufacturerSYNC POWER Crop.
Websitehttp://www.syncpower.com/

KINETICS Co., Ltd. is a professional analog IC design company. It was officially established on February 1, 2004 and moved into Taipei Nangang Software Park (NKSP). KINETICS products are mainly used in power management systems.

Integrating high-tech IC design talents from the United States and Taiwan, KINETICS Inc. is dedicated to the design and development of power management ICs. We also develop and design field-effect power devices such as Trench POWER MOSFET and TVS ESD protection devices to provide customers with more competitive power management system components and effectively protect the safety of electronic products.

KINETICS Technology Co., Ltd. holds several U.S. patents for synchronous rectification power management ICs. Based on these patented technologies, we continue to develop and design more forward-looking and high-performance power management ICs, and keep pace with world-class power management design companies.

QINGLI Technology uses high-density Trench POWER MOSFET process to design products, and adopts the industry's most advanced packaging and the most sophisticated packaging type, which is particularly suitable for handheld electronic product systems.

The TVS ESD protection components of QINGLI Technology are the most advanced packaging type and are adopted by many international system manufacturers. The fine packaging type is particularly suitable for electronic communication products, effectively and precisely protecting the system for safe use.

KINETICS Co., Ltd. provides closer customer service in a synchronous growth mode, allowing customers and KINETICS to achieve a win-win situation in terms of industrial technology and market competition.

In accordance with the provisions of the Recycling and Environmental Protection Act on banned substances, the company develops green products with pollution-free raw materials. The products are inspected and certified by the internationally renowned certification agency SGS and fully comply with the ROHS world environmental protection standards.

In September 2005, KINETIC TECHNOLOGY CO., LTD. passed the AFQA (ISO 9001: 2008) certification.

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SPP1413 Overview

Trench FET

Features

产品名称:溝槽式場效電晶體


Product model: SPP1413


Product Description:


The SPP1413 is the P-Channel logic enhancement mode


power field effect transistors are produced using high cell


density , DMOS trench technology.


This high density process is especially tailored to


minimize on-state resistance.


These devices are particularly suited for low voltage


application such as cellular phone and notebook


computer power management and other battery powered


circuits where high-side switching , and low in-line


power loss are needed in a very small outline surface


mount package.



parameter:


TYPE:P


VDSS:20V


VGS:12V


VTH:min 0.5


Max 1.8


IDS: 2.9A at 25°C


RDS: 130mΩ at 10V


150mΩ at 4.5V


PD:0.33W


Package: SOT-323


SPP1413 Preview

Download Datasheet
SPP1413
P-Channel Enhancement Mode MOSFET
DESCRIPTION
The SPP1413 is the P-Channel logic enhancement mode
power field effect transistors are produced using high cell
density , DMOS trench technology.
This high density process is especially tailored to
minimize on-state resistance.
These devices are particularly suited for low voltage
application such as cellular phone and notebook
computer power management and other battery powered
circuits where high-side switching , and low in-line
power loss are needed in a very small outline surface
mount package.
APPLICATIONS
Power Management in Note book
Portable Equipment
Battery Powered System
DC/DC Converter
Load Switch
DSC
LCD Display inverter
FEATURES
-20V/-2.4A,R
DS(ON)
=130mΩ@V
GS
=- 10V
-20V/-2.9A,R
DS(ON)
=150mΩ@V
GS
=- 4.5V
Super high density cell design for extremely low
RDS (ON)
Exceptional on-resistance and maximum DC
current capability
SOT-323 ( SC–70 ) package design
PIN CONFIGURATION ( SOT-323 ; SC-70 )
PART MARKING
2006/03/20
Ver.2
Page 1
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